Scientific coordinator:

Cupersafety S.r.l. (IT)

Type: PON - H2020

End date: 2022

Start date: 2018

Duration: 48

Overall budget: € 2.363.588,75

Funding: € 1.276.898,24

STIIMA budget: € 1.414.912,50

STIIMA funding: € 582.790,63

HELMS - Sviluppo di sistemi elettronici embedded ad alte prestazioni/High-performance Electronic embedded Systems

The aim of the HELMS project is the development of innovative methodologies, procedures and tools for the design, manufacturing and testing of innovative rigid and rigid-flexible printed circuit boards (PCB) with discrete, active and passive electronic components, fully integrated into the support (embedded). Embedded PCBs have applications in numerous sectors such as aerospace, home automation, biomedical, automotive, ICT and consumer electronics.
The research and development activities are focused on:

  • Development of numerical thermo-mechanical models of embedded PCBs with passive micro-components, as tools for aiding product design, reliability analysis and testing;
  • Development of numerical multi-physics models of the stack-up lamination and curing to predict layer thicknesses and embedded micro-components failures. These numerical models, validated by experimental data gathered by the industrial partners, will support both the product design (aiding the definition of components and layers layout) and manufacturing;
  • Development of a robotic cell for the automated handling and assembly of micro-components on the PCB rigid layers;
  • Design and development of a robotic cell for the automated handling and assembly of flexible bodies (coverlays) onto PCB flexible layers, including grippers and auxiliary equipment;
  • Definition of procedures and technologies for the non-descructive tests (NDT) of embedded PCB.